"

千赢官网登录|中文官网№拥有全球最顶尖的原生APP,每天为您提供千场精彩体育赛事,千赢官网登录|中文官网№更有真人、彩票、电子老虎机、真人电子竞技游戏等多种娱乐方式选择,千赢官网登录|中文官网№让您尽享娱乐、赛事投注等,且无后顾之忧!

  • <xmp id="mqm4k">
    <menu id="mqm4k"></menu>
    <menu id="mqm4k"></menu>
  • <xmp id="mqm4k"><menu id="mqm4k"></menu>
  • <menu id="mqm4k"><strong id="mqm4k"></strong></menu>
  • <menu id="mqm4k"></menu>
    <menu id="mqm4k"></menu>
  • <optgroup id="mqm4k"></optgroup><xmp id="mqm4k">
    <menu id="mqm4k"><menu id="mqm4k"></menu></menu>
    <menu id="mqm4k"><tt id="mqm4k"></tt></menu>
  • <nav id="mqm4k"><code id="mqm4k"></code></nav>
    "
    bismuth  Bi
    Available form
    Ingot/granule/powder
    Application field

     

    Application Field
    Bi Bismuth
     
    Technical connection: electrolysis - regional smelting
     
    1. Physical properties:
     
    Atomic weight: 208.98040
     
    Electronegativity: 1.9
     
    Density: 9.78 g/cm3
     
    Melting point: 271.50 ℃
     
    Boiling point: 1564 ℃
     
    2. Purpose:
     
    It is mainly used for preparing group compound semiconductor, high purity alloy, electronic refrigeration element, thermoelectric conversion element and liquid cooling carrier in atomic reactor.

    Product description
    Describe
    Bi Bismuth
    Technical connection: electrolysis - regional smelting
    Test: icp-ms; Laser particle size analyzer, scanning electron microscope.
    Service: provide practical protective measures and material application solutions.
    1. Physical properties:
    Atomic weight: 208.98040
    Electronegativity: 1.9
    Density: 9.78 g/cm3
    Melting point: 271.50 ℃
    Boiling point: 1564 ℃
    2. Specifications:
    Chemical purity:
    High purity bismuth: bi-05 purity 99.999% above, silver, aluminum, arsenic, gold, cadmium, chromium, copper, iron, magnesium, nickel, lead, tin, zinc impurity total content is less than 10ppm;
    Ultra-pure bismuth: bi-06 purity 99.9999% above, silver, aluminum, arsenic, gold, cadmium, copper, iron, magnesium, nickel, lead, zinc impurity total content less than 1ppm.
    3. Physical properties: ingot, powder, pill, granule, needle, etc.
    4. Purpose:
    It is mainly used for preparing group compound semiconductor, high purity alloy, electronic refrigeration element, thermoelectric conversion element and liquid cooling carrier in atomic reactor.
    5. Packaging: vacuum packaging of plastic film after polyester film packaging.
    Other materials
    千赢官网登录|中文官网
  • <xmp id="mqm4k">
    <menu id="mqm4k"></menu>
    <menu id="mqm4k"></menu>
  • <xmp id="mqm4k"><menu id="mqm4k"></menu>
  • <menu id="mqm4k"><strong id="mqm4k"></strong></menu>
  • <menu id="mqm4k"></menu>
    <menu id="mqm4k"></menu>
  • <optgroup id="mqm4k"></optgroup><xmp id="mqm4k">
    <menu id="mqm4k"><menu id="mqm4k"></menu></menu>
    <menu id="mqm4k"><tt id="mqm4k"></tt></menu>
  • <nav id="mqm4k"><code id="mqm4k"></code></nav>